英文版芯片封装

ICPACKAGINGPREPAREDBY:SSSENG/24FEB2004

ICPACKAGINGPREPAREDBY:SSSENG/24FEB2004

SEMICONDUCTORMFG

(BACK-END/PACKAGING)SMTPLASTICPACKAGE:WAFERSAW/DICINGDIEATTACH/MOUNTWIREBONDINGMOLDING/ENCAPSULATIONCROPPING/TRIMFORMSOLDERDIPPINGTESTINGPACKINGSHIPPINGPREPAREDBY:SSSENG/24FEB2004

SEMICONDUCTORMFG

(BACK-END/PACKAGING)BGA:WAFERSAW/DICINGDIEATTACH/MOUNTWIREBONDINGMOLDING/ENCAPSULATIONSAWINGSOLDERBALLATTACHTESTINGPACKINGSHIPPINGPREPAREDBY:SSSENG/24FEB2004

WAFERSAW/DICINGPREPAREDBY:SSSENG/24FEB2004

WAFERSAW/DICINGPREPAREDBY:SSSENG/24FEB2004

WAFERSAW/DICINGSingulationofindividualdie:MountingtapeframeSawbladesWashingTapeCuringPREPAREDBY:SSSENG/24FEB2004

DIEATTACH/MOUNTPREPAREDBY:SSSENG/24FEB2004

DIEATTACH/MOUNTAttachdietoleadframe/substrate:EpoxygluedispensinguntoleadframeDieattachEpoxygluecuringPREPAREDBY:SSSENG/24FEB2004

WIREBONDINGPREPAREDBY:SSSENG/24FEB2004

WIREBONDINGConnectdietoexternalleads:Wires–Au/Cu/AlThermosonicbonding1stBond–Ballbond2ndBond–StitchbondPREPAREDBY:SSSENG/24FEB2004

MOLD/ENCAPSULATIONPREPAREDBY:SSSENG/24FEB2004

MOLD/ENCAPSULATIONProtectinternalcircuitfromexternalenvironment:TransfermoldingMoldcuringPREPAREDBY:SSSENG/24FEB2004

CROPPING/TRIMFORMPREPAREDBY:SSSENG/24FEB2004

CROPPING/TRIMFORM/MARKINGSingulationofindividualICunit(endproduct):CutdambarsandunwantedleadframeFormleadsperspecificationMarking:LasermarkingPrintPREPAREDBY:SSSENG/24FEB2004

SOLDERDIPPINGPREPAREDBY:SSSENG/24FEB2004

SOLDERDIPPINGLeadfinishingwithcoatedsolder:FluxSolderdipPREPAREDBY:SSSENG/24FEB2004

TESTINGPREPAREDBY:SSSENG/24FEB2004

TESTING100%testingofallunits:ContinuityfailureFunctionalfailureParametricfailurePREPAREDBY:SSSENG/24FEB2004

PACKINGSHIPPINGPREPAREDBY:SSSENG/24FEB2004

PACKINGSHIPPINGPackingshippingofpartstocustomers:Reels,trays,tubesDry-packLabellingsPREPAREDBY:SSSENG/24FEB2004

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